PRINT4PACK

By | October 28, 2013
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PRINT4PACK logo

The objective is to develop new technique which can be used for low cost, radio frequency (RF) sensing. The main target of the project is RF temperature sensing and logging for chilled, frozen and fresh food. The technology comprises a printed temperature sensor, printed power supplier (supercapacitor), and printed RFID antenna coupled with very low cost chips. The project also includes development of suitable polymer substrates with appropriate properties for high speed/high precision printing.

 

LEITAT’s role in the project: LEITAT will participate in the PRINT4PACK project as a research organisation adding technological value and dealing with the following activities in collaboration with Chimigraf and Enplater:

• Ink formulation of gravure printing inks for temperature sensors, RFID antenna and development of the 3-layer system for supercapacitors.

• Design and printing of passive printed electronic components by low cost gravure printing.

• Characterization of inks and printed polymeric film surfaces for food applications.

• Characterization and modelling of the relevant parameters of the developed devices.

 

LEITAT participates as subcontractor according to Catalan rules

Number of Contract: RDNET12-2-0008

 

Coordinator:  CHIMIGRAF IBÉRICA

 

Email LEITAT manager in charge: Marta Domper

 

WebPrint4Pack project

 

Starts: 03/12/2012

 

Duration: 2,5 years

 

Partners

 

Chimigraf   Ibérica SL Spain
Zettlex United Kingdom
Plasto-sac Israel
Envases   Plasticos Del Ter SA Spain
LEITAT   Technological Center Spain

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